Here is the history of our company, from our founding to the present day.
- 1956
-
April
Eiichi Asada established SHOEI CHEMICAL CO.,LTD. in Tsukiji, Chuo-ku, Tokyo
- 1959
-
June
Changed the company name to SHOEI CHEMICAL INC.
- 1962
-
May
Moved the head office and factory to Toyotama-Kita in Nerima-ku, Tokyo
- 1967
-
April
Established plant in Suehiro-cho, Ome-shi, Tokyo
- 1974
-
April
Moved the head office to Shinjuku Sumitomo Building in Nishi Shinjuku, Shinjuku-ku, Tokyo
- 1983
-
November
Moved the head office to Shinjuku Mitsui Building in Nishi Shinjuku, Shinjuku-ku, Tokyo
- 1987
-
January
Established plant in Fujinoki-machi, Tosu-shi, Saga
- 1993
-
October
Established US affiliate, SHOEI ELECTRONIC MATERIALS, INC.
- 1995
-
December
Established Singapore affiliate, SHOEI CHEMICAL SINGAPORE PTE. LTD.
- 1998
-
August
Obtained ISO14001 certification at Tosu Plant
- 2003
-
March
Obtained ISO9001 certification at Tosu Plant
- 2007
-
May
Acquired CANADIAN ELECTRONIC POWDERS CORPORATION (Canada)
- 2011
-
May
Obtained ISO/TS 16949 certification at Tosu Plant
- 2012
-
May
Established Canada affiliate SHOEI CANADA CORPORATION
- 2013
-
April
SHOEI CANADA CORPORATION merged with CANADIAN ELECTRONIC POWDERS CORPORATION
- 2016
-
June
Completed a new office building at Tosu Plant
- 2018
-
February
Transferred the R&D department of Ome Plant to Tosu Plant and closed Ome Plant
- 2020
-
August
Announced a collaboration with U.S. company Nanosys Inc. in the QD business
- 2023
-
August
Acquired the QD business of U.S. company Nanosys Inc.
- 2024
-
January
Established plant in Higashi, Itoshima-shi, Fukuoka
- 1957
-
Launched the sales of sedimentation promoter Separl 101
- 1958
-
Started manufacturing and sales of Nickel Oxide for Ferrite
- 1959
-
Started manufacturing and sales of Silver Liquid for Disc Ceramic Capacitors
- 1963
-
Obtained Shoei’s first patent for Conductive Silver Paint
- 1965
-
Started manufacturing and sales of Ag Paste for Tubular Ceramic Capacitors
- 1966
-
Started manufacturing and sales of Ag Paste for Piezoelectric Elements
- 1968
-
Started manufacturing and sales of AgPd Paste for Thick Film Hybrid ICs
- 1970
-
Started manufacturing and sales of RuO2Resistive Paste for Thick Film Hybrid ICs
- 1971
-
Started manufacturing and sales of Au Paste for Display Tube Circuits
- 1972
-
Started manufacturing and sales of Ag Paste for Conductive Adhesives and Printed Wiring Board Circuits
- 1973
-
Started manufacturing and sales of Pd Paste for Multilayer Capacitor Inner Electrodes
- 1978
-
Started manufacturing and sales of Ag Paste and Glass Paste for Multilayer Capacitors
- 1980
-
Started manufacturing and sales of Ag Paste for Solar Cells
- 1982
-
Started manufacturing and sales of AgPd Paste for Multilayer Capacitors
- 1989
-
Started manufacturing and sales of Ni Paste for MLCC Outer Electrodes
- 1991
-
Developed metal powder manufacturing technology using Spray Pyrolysis
- 1991
-
Started manufacturing and sales of Pd Powder and AgPd Powder for MLCC
- 1995
-
Started manufacturing and sales of Cu Paste for MLCC Outer Electrodes
- 1997
-
Started manufacturing and sales of Ni Powder and Ni Paste for MLCC Inner Electrodes
- 2002
-
Developed new metal powder manufacturing technology by apray pyrolysis developed.
- 2007
-
Developed ultra-fine metal powder technology using PVD method
- 2016
-
Started manufacturing and sales of Magnetic Powder for Metal Core Inductors and Glass-Coated CuNi Alloy Powder
- 2017
-
Developed mass production technology for QD
- 2021
-
Started manufacturing and sales of QD products
