■Metal Powders
Chemical process or thermo-physical process is used to manufacture conductive metal powders (precious metals such as gold, silver, platinum, palladium, and ruthenium; and base metals such as copper, nickel and zinc) that have various sizes from several microns to nano-meters. Depending on the features required, it is also possible to give them structural shapes such as poly-crystalline, micro-crystalline, mono-crystalline and flakes. We have designed these powders as conductive filler for pastes used to form the conductive film for electronic component electrodes and electric circuits, and offer a wide variety ranging from single component powders to composite or alloy powders.

■Other Powders
Our line-up includes fine powders ranging from several microns to sub-microns, including glass and ceramic powders with insulating properties as well as metal oxide powders. These powders are designed (1) to assist in metal powder sintering, (2) to bond metal powders to substrates, or (3) to control (1) and (2) in a balanced manner by using them as single or combined additives for conductive or resistive pastes. Furthermore, these powders are designed to function as a primary element of pastes for the purpose of circuit insulation.